A semiconductor die assembly comprising a semiconductor die with bond pads, a plurality of leads which extend across the semiconductor die and terminates over their respective bond pads, and an alpha barrier preferably positioned between the leads and the semiconductor die. In one example, one or more SD print applications are determined based on prior usage of SD print applications in a printer application store by a user of a web connected computing device. The provider may be either centralized or distributed depending upon the requirements of a particular application.