A heatsink for use in injection molding, with at least one load-bearing path with a rearward segment, wherein at least a portion of at least one non-load-bearing, dynamic heat-transfer zone of the heatsink is laterally offset from the rearward segment of the load-bearing path. The leadthrough is composed of two portions of different diameters, with the outer portion resting on the end face of the stopper. The method includes receiving a signal at the microphone array and applying adaptive beam-forming to the signal to yield an enhanced source component of the signal. Information of an uplink resource carrier is received according to an uplink resource configured in the new frame structure of the first system.