The present invention relates to a substrate inspection apparatus for inspecting a pattern formed on a substrate by irradiating a charged particle beam onto the substrate. In particular, the present invention relates to a 3-dimensional image device with which the problem in prior art of spatial size in obtaining a background image is resolved, and with which a background image of a large display and a 3-dimensional image having an enhanced sense of depth and a large image are displayed simultaneously using only a single image source. The first and second upper structures have a plurality of ribs that press down on the common electrodes and sound absorbing pads.