A package assembly for electronic components that allows for low-cost multiple cavities as well as a multiple compartment structure that allows more components in a smaller package size. During the sampling phase, an input voltage is sampled. The receiving part is arranged at a front edge of the isolation body and has a first engaging element. A removable cover and the blade are easily changeable. A dye is attached to a fraction of the polymeric support which enables optical detection and monitoring of the affinity matrix and, accordingly, reduces the likelihood of the loss of affinity matrix during the separation step.