A slide-type cylinder coupling which is suitable for the quick connectdisconnect attachment of a lift piston on a pedestal lift cylinder to a lift pedestal on a load cup or HCLU station of a chemical mechanical polishing apparatus. A second low pass filter includes a second coil that is connected between a second outer electrode and the main line and has a characteristic in which attenuation increases with increasing frequency in the certain frequency band. The end-point detection unit monitors the structure being etched at a region outside the opening that is to be filled, and generates in real time data representative of the layer that is being etched. In some cases, the cutting members include a bent portion, and the localized heat-treating process is used to enhance ductility and thereby facilitate formation of the bent portion. In one embodiment, in response to a predetermined number of toggles of the clock signal, the buffer is automatically powered up.