The invention provides for polysilicon vias connecting conductive polysilicon layers formed at different heights. In the relay, a pair of moveable switching contacts is attached to the free end of a piezoelectric actuator and positioned between a pair of fixed electrical contact pads. The upper portion of the body defines an inverted T-shaped recess having a horizontal and lower part having the same depth as the lower quadrangular recess. The thermal stability of the metal on dielectric layers such as SiO2, Al2O3 and other suitable dielectric materials makes it compatible with post-processing temperatures up to 1000\xb0 C.