Disclosed is a uni-knot tying device. Processing is laser performed on selected semiconductor material whose internal crystalline structure becomes appropriately changed to establish the desired mechanical properties for a created device. The device further includes an assembly part including a through hole, and a ring housed in a manner that can be oriented within the through hole. Audio interruption can be reduced, thereby securing a minimum audio QoS. The contacting may be carried out in the presence or absence of a solvent and in the presence or absence of oxygen.