Described is a semiconductor package frame including a material comprising wire openings a die-mounting surface area with a die-mounting surface and identification markings included within the die-mounting surface. The apparatus includes a supply nozzle configured to supply liquid to the space, a supply path configured to supply the liquid to the supply nozzle, a bypass which branches from the supply path, and a supply control valve configured to change a flow rate of the liquid supplied from the supply path to the supply nozzle and a flow rate of the liquid supplied from the supply path to the bypass. The ear portion of the frame includes a first side and a second side opposite the first side. This threaded engagements enables tightening of the quick coupling cap by rotation about the threaded bolt shank.