This invention includes methods of forming phosphorus doped silicon dioxide comprising layers, and methods of forming trench isolation in the fabrication of integrated circuitry. The temporary fixation wire includes an abutment member that can compress the bone fixation plate against an underlying bone so that the alignment of the bone fixation plate on the bone can be analyzed prior to using bone fixation members to permanently attach the bone fixation plate to the underlying bone. When one of the substrate arrangement devices is in the horizontal posture, masks and the substrates are lifted up by alignment pins and transfer pins and are replaced with a substrate not yet film formed, for position adjustment. The inductor may be partially or fully realised by printed conductive lines andor bonding wires.