A device and method for dynamically sealing between rotatable members such as a rolling cone of a rock bit. The memory device includes a substrate, buried bit lines, word line structures, a dielectric layer, conductive lines in trenches and self-aligned contacts. The copper interconnection film has crystal conformity with the noble metal liner film. The uppermost semiconductor chip may have the same elements as the lower semiconductor chip, and may be flip chip bonded to the through holes.