A process for manufacturing a flexible wiring board according to the present invention includes growing metal bumps using a mask film patterned by photolithography. The educational toy apparatus includes an indicium containing structure and a base unit capable of being vertically attached to a vertical surface such as a refrigerator door. Therefore, the TLPM and the planar devices can be connected electrically to each other by resulting metal wiring layers and polysilicon layers without the need for performing wire bonding on a printed circuit board. The disclosure provides systems and methods for configuring a cluster, managing a cluster, managing an MQ in a cluster, a user interface for configuring and managing the cluster, an architecture for using specialty engines in a cluster configuration, and interconnect between cluster components, and a file system for use in a cluster.