A method for forming smooth walled, prismatically-profiled through-wafer vias and articles formed through the method. In one or more implementations, multiple croppings of a scene are scored based on parameters that indicate visual characteristics established for visually pleasing croppings. Calculating circuitry, coupled to the spectral peak detecting circuitry, calculates a parameter value corresponding to each detected spectral peak. In response to selection of the support button, the computer accesses support information regarding the page from a knowledge database that is separate from the software application. On the basis of sensor data obtained by integration executed in the AF area sensor in an outline detection mode, the distance-measuring device detects a main subject in a photography screen, sets a distance-measuring area including the main subject, and measures a distance to the main subject. The illumination device comprises detachable perimeter support frame with integrated multiple illumination LED’s thereabout for uniform illumination of an object to be viewed.