A tray for transporting a wafer is herein provided, which can control the temperature of the wafer upon the processing thereof, and which can easily fix the wafer without reducing the effective area on the surface of the wafer and without requiring much time for the adhesion of the wafer thereto and without requiring any post-treatment after the wafer is detached from or attached to the tray. The invention intelligently, and dynamically, controls the connection of a respective switch input to a respective switch output as a function of a carrier being present, or absent, at a selected output. Thickening the lower area of the front face lowers the center of gravity and upwardly shifts the coefficient of restitution to the geometric center of the face.