In a robotic system having a two-axis robotic wrist connected to a reference member, the wrist has a movable member movable relative to the reference member in pitch and yaw. Unnecessary increasing of package dimensions is avoided by providing a semiconductor device comprising a package having a semiconductor element mounting region, a first region containing the aforementioned mounting region, and a second region partially adjoining the periphery of the above-described first region. The metal structure has a such shape that having an upper portion with a first width and a lower portion with a second width. A wiring connected to the protective elements and positioned under the grounding wiring and the power supply wiring is pulled out in a pulling-out region between the nMISFET forming region and the pMISFET forming region and between the grounding wiring and the power supply wiring to be connected to the conductive layer.