A packaging substrate with an embedded photosensitive semiconductor chip and a method for fabricating the same are provided. Thereby, a display device which reduces the signal clock frequency as well as increases the signal writing time, enhances the opening rate of an LC panel and permits a highly fine display and a high speed motion picture display, is obtained. The one or more engagement sensor may be mechanical, electric, or magnetic and may be located at various locations on the overshot device, the tool string, or both. The sidepieces, when hinged together, are moveable between a collapsed arrangement and an open arrangement. An amount of distortion is obtained by summing up weighted differences between a reference pixel value and gained pixel value of first pixels having gained pixel value not distributed within first distribution range.