One exemplary disclosed embodiment comprises a high power semiconductor package configured as a buck converter having a control transistor and a sync transistor disposed on a common leadframe pad, a driver integrated circuit for driving the control and sync transistors, and conductive clips electrically coupling the top surfaces of the transistors to substrate pads such as leadframe pads. The dilating shaft has a cross-diameter substantially equal to the cross-diameter of the plug and is terminated by a conical spike. The sensor is configured to detect an object in the path of the panel without monitoring the motor. For example, the system can calibrate for significant differences in the pressure of the water supply provided to the appliance during operation.