A wiring substrate having variously sized ball pads, a semiconductor package including the wiring substrate, and a stack package using the semiconductor package, to improve board level reliability of a semiconductor package or stack package mounted on a mother board are shown. Accordingly, it is possible to form an etched pattern by applying a negative bias to a micro tip without applying a strong mechanical force to the micro tip, and heatingmelting the metal layer with the use of an electron beam emitted from the micro tip which is negative-biased. The connecting mechanism connects the motor generator to an auxiliary device and selectively connects the motor generator to the engine. Given the skewed-form output results required by the systolic array and generated by the input pattern generator, the processing element array makes a set of correlating comparisons, and outputs the results of the correlating comparisons to the boundary processing elements, so as to acquire the decoding results required by the CFRS decoding. The lens fastener pushes the circumferential part of the optical lens, thereby to deform the elastic member to adjust the position of a focal point of the optical lens. The piezoelectric layer includes a lead concentration gradient region in which the lead concentration increases from the first conductive layer side to the second conductive layer side.