A seal ring structure is formed through a multilayer structure of a plurality of dielectric films in a peripheral part of a chip region to surround the chip region. In the chamber subjected to high pressure of the body, a cylindrically shaped pocket or an encompassing groove is embodied, into which the bore discharges, forming an intersection point. A plating fluid is provided between the wafer and the proximity head to create localized metallic plating. A plurality of error event masks and error event metrics can be generated based on the decoded information and the path metric differences.