A heat-dissipation module dissipating heat for a heat-generating element on circuit board and including a heat-transferring base, a base, a first heat-dissipation unit, a heat pipe and a second heat-dissipation unit is provided. The first and second supply lines are connected to a source of hydraulic fluid. Thereby, it is possible to form the insulating film thick and flatter on a substrate. In one embodiment, to create the worker execution entity with the second affinity setting, the system first creates a delegate execution entity that has the first affinity setting. A first cover sheet overlays the first sheet-like stiffener to sandwich the sheet like stiffener between the first surface of the core and the first cover sheet.