A lead-frame for connecting and supporting an integrated circuit having an apertured frame with dimensions smaller than the corresponding dimensions of the chip so that chip-pad shoulder can be eliminated and the chip attach fillet is made remote from the chip corner. The coding is achieved using a concatenated approach, with the inner code being Trellis Coded Modulation, using, for example, convolutional coding, and the outer code being a Reed Solomon code. The second substrate has an electrical wiring circuit, an optical-electrical converter for converting the optical signal to the electrical signal, and a light receiving device for receiving the light from the light emitted device.