A circuit board is provided in which peeling strength is prevented from decreasing and a connection resistance to a conductive material is prevented from increasing, though the contact area decreases when the circuit board has a copper foil. A through groove passes through the semiconductor substrate from a surface to an opposite surface. The blades are welded to the center hub and end plates at either end of the impeller. They may also consist of cell assemblies of wound electrode configurations or plate-serpentine configurations having multiple parallel connections to the cell casing. , max-CI or Proportionally Fair.