A stacked die semiconductor package includes a first integrated circuit chip, a first circuit tape coupled to the first integrated circuit chip, a second integrated circuit chip coupled to the first circuit tape, and at least one component coupled to the first circuit tape. The test may therefore be performed using the automatically distributed code. A plurality of terminals are assembled to the receiving slots of the terminal block and each terminal has a contacting portion, a soldering portion and a base portion connecting with the contacting portion and the soldering portion.