A ramp-stack chip package is described. The brackets are pivotally connected together with central portions being abutted in side-by-side relationship for limited relative rotation. As a result of the oxidizing agent used in the batch, the iron is oxidized to a very low FeO content. Detents engage the motor cup with the drum at a plurality of different cutting heights. The first layer of dielectric may also be eliminated, creating the wide thick interconnect network on the surface of the layer of passivation that has been deposited over the surface of a substrate.