A method for implant uniformity is provided that includes determining a variation of critical dimensions of a semiconductor wafer, moving the semiconductor wafer in a two-dimensional mode during an implantation process, and controlling a velocity of the movement of the semiconductor wafer so that an implant dose to the semiconductor wafer is varied based on the variation of CD. A clip or coupling is attached to auxiliary eyewear and configured for connection to the docking head so as to removably attach the auxiliary eyewear to the primary eyeglasses. The vacuum accessory has a rearward facing vacuum tube which is adapted to engage a vacuum hose from a vacuum device.