A semiconductor chip package has a pillar body including at least three conductors insulated from each other by an insulating layer. At lower sides of the extension portions, a pair of first antiferromagnetic layers is formed with a space therebetween in a track width direction, and in addition, at upper sides of the extension portions, a pair of second antiferromagnetic layers is formed with a space therebetween in the track width direction. The circuit also has a signal strength sensing circuit connected to receive at least one of the sensor signal and the filtered sensor signal, the signal strength sensing circuit producing a variable threshold signal, which is a substantially monotonically non-decreasing function of a strength of the sensor signal. View selection criteria includes a criterion other than viewpoint.