A method for forming an integrated circuit structure includes forming a test wafer. In one embodiment, an amount of energy is delivered to the surface of the substrate to preferentially melt certain desired regions of the substrate to remove unwanted damage created from prior processing steps, more evenly distribute dopants in various regions of the substrate, andor activate various regions of the substrate. The double-arm levers together with the troughs form a system of hinged parallelograms, providing uniform distribution of pulsations along the whole capacity of the upper trough that produces conditions for the intensification of the jigging process.