A multilayer circuit substrate for multi-chip modules or hybrid circuits includes a dielectric base substrate, conductors formed on the base substrate and a vacuum deposited dielectric thin film formed over the conductors and the base substrate. The semiconductor memory device may include a memory cell array having a plurality of strings each including a drain select transistor, a plurality of drain side memory cells, a pipe transistor, a plurality of source side memory cells, and a source select transistor. In addition, vertical core-in-kettle heat exchangers can exhibit enhanced heat transfer efficiency due to improved refrigerant access to the core, improved refrigerant circulation around the core, andor improved vaporliquid disengagement above the core. The first chamber interior is isolated from the second chamber interior. Further, the present invention also proposes a method of assembling the lightning protection device. New antibodies that are particularly well adapted to the multiplex assay are also provided.