Copper plating baths containing a leveling agent that is a reaction product of a compound including a heteroatom chosen from nitrogen, sulfur and a mixture of nitrogen and sulfur, with a polyepoxide compound containing an ether linkage that deposit copper on the surface of an electronic device and in apertures on such substrate are provided. The compound of the formula I and its physiologically tolerable salts are valuable pharmacologically active compounds which can be used, for example, in the treatment or prophylaxis of diseases which can be influenced by inhibiting the vitronectin receptor, for example of bone diseases such as osteoporosis. A barrier layer is formed over the plasma-treated agglutinating layer, and a conductive layer is formed over the barrier layer. The second shaft has a region of enlarged diameter located axially aft of the compressor rotor but axially forward of the forward end of the first shaft. The cache logic is further configured to store the memory line in the selected way. In some embodiments, a method may include initiating, by a device coupled to a CAN, transmission of a message via the CAN; detecting an error by the device during the transmission; and continuing, by the device after having detected the error, the transmission of the message without causing or indicating a bus error condition.