A method of manufacturing a semiconductor laser device comprises steps of forming a first semiconductor laser device substrate having first grooves for cleavage on a surface thereof, bonding a second semiconductor laser device substrate onto the surface side having the first grooves and thereafter cleaving the first and second semiconductor laser device substrates along at least the first grooves. In particular, the means for form-fit connection are assigned to two mutually opposite circumferential portions of the filter disc. Expansion and contraction of the chamber occurs by either the plunger reciprocating in the chamber or a piston coupled to the plunger reciprocating in the chamber.