The semiconductor integrated circuit incorporates a PLL circuit including a phase-frequency comparator 1, first and second charge pumps 2 and 3, a loop filter 4, a voltage-control oscillator 5 and a divider 6. The parse module further selects a parsed object that is differentiated from the stored objects as the first object and stores the first object with a location description. Inner material, which cover the sealing sections and rear edge of the film package 11 and are adhered to the inner surface of the storage space, affixing the film package within the storage space, are provided in a rectangular framework to the regions in the storage space of the container that correspond to said sealing sections and rear edge. It comprises means of setting, recording, calculating and analogue and digital viewing. The method further includes repeating the steps of providing a layer of powder material, selectively depositing bonding inhibitor, and promoting bonding until the 3-D object is formed.