A compound of formula I or a salt thereofML1L22+\u2003\u2003where M is selected from the group consisting of platinum, palladium and copper; L1 is an intercalator moiety; and L2 is a bidentate ligand, provided that when L2 is other than a bidentate ligand containing an aryl or phenyl group, L2 is a chiral bidentate ligand. The methods of the invention include the formation of a scribe foundation on the front side of the semiconductor wafer designed to accept laser scribing, and laser scribing the scribe foundation. The connector is configured such that when the locking member is in a first position, the transverse rod is temporarily fixed to the connector, and when the locking member is in a second position, both the transverse rod and spinal implant rod are fixed to the connector. Each of the electric sparks preferably has a separate and mutually exclusive firing point initiating from the single primary electrode and terminating at the single grounding electrode.