A semiconductor device has a resin package layer on a principal surface of a semiconductor chip, on which a number of bump electrodes are formed, wherein the semiconductor device has a chamfer surface or a stepped surface on a top edge part such that the external shock or stress applied to such an edge part is dissipated by the chamfer surface of the stepped surface. In a particular aspect, a performance parameter of a communication between a user equipment and the access point base station is monitored. The system may also be configured to operate in a pull mode pursuant to which the application initiates the forwarding, to the application, of a second sequence of data packets received by the protocol stack. Sections are removed from the traces by using a laser, CVD, a router, a plasma or by passing sufficient current through weakened areas of the traces.