An apparatus and method for making fault interrupter receptacles tolerant to miswiring errors. To handle varying levels of network traffic, the link efficiency modules provide multiple modes of operation to balance bandwidth efficiency against packet latency. The die and the stud bump are covered with a first encapsulation material, and then at least a portion of the stud bump is exposed. An exterior banding structure is provided which is positioned adjacent to the encapsulation wrap and includes a plurality of vents to improve its heat dissipation properties and may include exterior fins. The first groove has a groove axis parallel to both the groove sidewalls and the tongue axis. Self-aligned contact structures can also be produced on a semiconductor body, with or without using the spacer layer.