A manufactured multi-layered silicon wafer with a buried insulating layer and buried areas with different parameters is formed by bonding together a first wafer and a second wafer. The insulating members are formed of a poly resin, a polyimide resin, a poly resin or the like. The racking assembly includes a safety interlock, which is movable between a locked position, and an unlocked position corresponding to the racking assembly being operable to rack the electrical apparatus into or out of the enclosure. The computer system for this system may include a PBX system and computers capable of managing phone calls to and from the PBX system to accommodate both two party and multiple party calls. The modulation depth can be further improved by using an impedance transformer and magnetic core.