A small planar antenna with an enhanced bandwidth and a small rectenna for RFID and wireless sensor transponder are provided. A plurality of dies is bonded onto a front surface of the interposer wafer. In an alternative, the received pattern is compared against first and second known synchronization patterns. 57 mm and a distance between adjacent portions of the line-shaped noise becomes 7. This plating solution utilizes the high speed property of gloss agents to the maximum, does not have an effect on the current density, gives stable non- or semi-gloss plating appearance, and facilitates control. The wrap determination is made prior to the comparison between the TTA and TTAT values which is made in order to determine whether the user is complying with his or her contracted parameters.