A manufacturing method of an electrode structure and a thin-film structural body, which can remove a sacrifice film without removing other insulating films. The surface includes polygons to be changed from an initial size to a larger size as the surface is changed to a lower resolution as part of tessellating the surface. The base makes electrical contact with a peripheral surface of the heat sink, and multiple-jointed spring fingers extend from the base to make electrical contact with conductive pads on the PCB. A cushion support contour created from the equally-loaded negative impression is beneficial in more appropriately supporting the anatomical portion. The system comprises a core array having a plurality of columns and a redundancy column each configured for reading or writing a bit of information and circuitry for steering around a defective column in the core array, wherein the circuitry includes one column multiplexor, which results in having the memory column redundancy scheme include one multiplexing stage.