A method of forming a semiconductor interconnect including, in the order recited: providing a semiconductor wafer; forming bonding pads in a terminal wiring level on the frontside of the wafer; reducing the thickness of the wafer; forming solder bumps on the bonding pads; and dicing the wafer into bumped semiconductor chips. The locking mechanism includes an elastic piece projecting in cantilever fashion from an end of the guide body, an operating projection that projects from the elastic piece, and an engaging protrusion that protrudes from the elastic piece and that is adapted to intrude into a screw hole in the electronic device unit to thereby restrict sliding of the electronic device unit. Policy filtered routing information is flooded throughout the domain of the network device.