The present invention discloses a semiconductor package, wherein several chips can be packed thereinto. A relatively simple speaker independent recognition algorithm, capable of recognizing a limited number of utterances at any one time, is associated with the base unit of an electronics product. The housing has a plurality of apertures therein. The groove is delimited by a groove bottom and two lateral walls. Upon detecting a buffer underflow, a fill operation is performed on the buffer and the playout delay is modified to provide a sufficient number of frames to be played out. The method can include indicating whether the feature of the layout cell complies with the ESD requirement.