Bonded composites, absorbent articles comprising such bonded composites, and processes for bonding thin-section elements. By hooking Twain function calls made by a Twain application on the server, the Twain function calls may be remoted over a virtual connection to a client system. Additionally, the first and second semiconductor dies are pressed together between a first substrate and a second substrate so that a front side of the first substrate is in contact with the back face of the first semiconductor die and a front side of the second substrate is in contact with the back face of the second semiconductor die. The laminate consists of at least two materials of different gas permeability.