A semiconductor device manufacturing apparatus includes a substrate holding section that holds a semiconductor wafer substrate, a discharge mechanism that discharges liquid drops of metal paste from a discharge nozzle toward a surface of the semiconductor wafer substrate, and a driving mechanism that moves at least one of the substrate holding section and the discharge nozzle. A driver, on receiving the pulse signal, turns on a first or second group of switches during the time periods corresponding to the high time periods of the pulse signal and turns on the other ones of the first and second group of switches during the time periods corresponding to the low time periods of the pulse signal. The clear pixel includes a second photo-detecting element and a clear pixel access transistor to selectively couple the second photo-detecting element to a second charge-storage node. Further, the semiconductor device is made high speed and high performance by using suitable TFT structures and electric power source voltages for pixels and driver circuits on a pixel substrate and for the logic circuit on the opposing substrate. The second controller is further configured to generate a data transfer trigger when the counter value corresponds with the trigger value such that the wireless communication element initiates a data transfer with a second wireless communication element in response to the data transfer trigger.