An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a polishing pad and a platen. The method includes, isolating a port if a loop initialization primitive is detected from a device coupled to the arbitrated loop; configuring the device and acquiring an AL_PA; determining if the device is sending LIPs; and isolating the device if the device continues to send LIPs. A primary inhibiting anode is adapted to be placed in a vicinity of a primary anodal longitudinal site of the nerve and to apply a primary anodal current to the nerve. In some embodiments, each surface comprises the foam covered with fabric.