A packaging laminate comprising a paperboard substrate for providing a base layer, a tear-resistant polymer layer applied to said substrate, and a heat seal polymer layer applied to said tear-resistant polymer. The system includes a phase-locked loop for receiving a reference clock as input and for outputting a PLL clock out. The adder circuit has a first ratio and a second ratio, and receives a reference voltage and a feedback voltage so as to output an adder voltage after an operation, wherein the feedback voltage is a voltage with a negative temperature coefficient, and the reference voltage is sum of a first voltage with a negative temperature coefficient and a second voltage with positive temperature coefficient. Also encompassed within this invention also are products of this selective process scheme and dentifrices containing such particularly manufactured and classified silica products. In another embodiment, a user is provided with the collective performance data for any execution path terminating at a breakpoint.