A method of forming a semiconductor device includes forming an under-bump metallurgy layer overlying a portion of a metal pad region within an opening of an encapsulating layer over a semiconductor substrate, and forming a bump layer overlying the UBM layer to fill the opening of the encapsulating layer. The light field morpher is applicable to morphing of objects having either or both Lambertian, or non-Lambertian surfaces, including surfaces having complex properties such as fur, subsurface scattering, and hypertextures, without the need for object modeling, or otherwise recovering detailed object geometry. Also a method for manufacturing the tube which can braze the tops of the beads with the opposed portions within the tube more securely and firmly than before. A funnel assembly positioned adjacent to the roller, along with a beveled entry wall at the entry end of the stationary groove, guide dough units into the rolling cavity. A transmission medium transmits the serial bit stream to an image processing module located outside of the high-radiation environment where a second SERDES deserializes the serial bit stream to generate a decoded image signal which is processed by an image processor to generate an output at a display device corresponding to the detected image. The resistive memory includes a chalcogenide compound containing 10 to 60 wt % of selenium or tellurium.