MEM devices are fabricated with integral dust covers, cover support posts and particle filters for reduced problems relating to particle contamination. The individual information is information regarding the manufacturing lots or the kinds of the process cartridge, a developer, the photosensitive drum, a charging roller for acting on the photosensitive drum, a developing apparatus, a cleaning apparatus, and a functional member of the charging roller. The electroplating continues until a planar layer of copper with a predetermined thickness is formed on the surface of the wafer. , more specifically to between 26\xb0 F. A short burst error detector may perform a short burst error detection on decoded data and erase any detected errors.