Bonding of flip-chip mounted light emitting devices having an irregular configuration is provided. According to one variant, the embossing tool is expanded by compressed air in order to be slipped onto the mounting shell or removed therefrom, a compressed air channel system with radial compressed air discharge openings extending axially andor tangentially within the mounting shell. The metal shield layer is disposed between the substrate and the conductive trace. This fee charging and payment system is too rigid for modern communications services. The edge connector is received by a female connector of a host device to connect the module to the host.