A multi-workpiece chamber includes at least two processing stations, for exposing workpieces to a treatment process. An opening is formed at a lower surface of the wafer along a scribe lane of the wafer. A drain contact hole forming portion is provided to the heavily-doped impurity region to reduce the contact resistance at the drain. Each of these scopes may contain similar cloud-based entity types, but because of the organization provided by scopes the tenant can manage these cloud-based entities according to the view and model that the tenant defines. The robot uses a turntable system, so that it can also freely change the movement direction thereof about the center thereof up to 360\xb0 without requiring any radius of rotation, to easily approach even a dead zone. In addition, the method includes removing and replacing at least a portion of the first structural material with a second structural material, the second structural material having insufficient mechanical characteristics to support metal during CMP.