A circuit substrate including a silicon substrate with through-holes formed therein, conducting films formed on the inside walls of the through-holes, and an organic resin film formed on the surface of at least one side of the silicon substrate and covering at least parts of the through-holes. Soil reinforcing transverse elements capture the distal ends of the facing panel on both the front face side and the back face side. The heat transfer plate is adhered to the trace assembly for mating engagement against the solid ink stick. The fuel inlet compartment can be inserted into an opening of the bodywork in a self-locking manner. % of polyolefin chunks produced.