A method of connecting a metal with a ceramic material comprises the steps of providing a through-hole in the ceramic material and positioning the metal to be connected to the ceramic material proximate to the ceramic material with the through-hole. The interface processing can comprise an oxygen inhibitor step with a bottom polysilicon electrode to prevent oxidation of the polysilicon layer, enhancing the electrical contact of the metal oxide film with the polysilicon electrode. The intersecting bond lines define unbonded pattern elements, each of the pattern elements being at least partially bounded by non-linear segments of the bond lines. One or more synchronization markers are located during the accessing of the media, and bit-level synchronization between the second source and the media is achieved based, at least partially, on the one or more synchronization markers. Provided are a semiconductor light-emitting element, a light-transmissive resin mold part encapsulating the semiconductor light-emitting element, and converting means for converting the output light from the semiconductor light-emitting element and emitting it.