A method for temporary wafer bonding employs an addition reaction curable adhesive composition. It includes a cylinder, a conical cylinder and a dust collector box connected in the given order from the upper part to the lower part, as well as an air outlet pipe and an air inlet pipe on the cylinder body. The mismatch detection system further includes a detection portion that generates a check item for each combination of a predetermined check subject and check specifics, and detects a mismatch of the statements based on a degree of similarity between the generated check item and a clustering result.