One of the aspects of the present invention is to provide a power semiconductor device, which includes at least one pair of power modules, each of which has a molding surface covered with molding resin and a radiating surface opposite to the molding surface. The substrate has a fluid channel having a micro-channel structure, through which a conductive fluid flows. A clamp is also provided that incorporates the jaw assembly. A partition hides the magnetized needle below, and simultaneously creates a compass face for the non-magnetic pointer above. In a further preferred embodiment, this assembly of wafers provides a hermetic barrier between the masses and an ambient environment. The ceramic material can also include oxides, borides, nitrides, carbides, silicides, or MAX phases.